Pay in 4 interest-free payments of $11.72 Learn more
Ships within 48 hours · Estimated delivery Aug 1 - Aug 6
The fabrication process ensures excellent uniformity of the structures across the chip
Width x Thickness 5367-10DLC PELCO® Pro High Precision
EDGEEC-V2-POT-100V
Standard all stainless steel
Wafer Thickness: 655-695 µm
3M™ Copper Conductive Tapes, Single Adhesive Surface Size:6.3mm W x 16.46m L The fabrication process ensures excellentDESCRIPTION The tape is easily cut to size and may be quickly applied to a specimen mount or other surface. Carbon or metallic coating normally is applied to the sample and mount. An electrical discharge bridge is then completed from sample, through the copper and its conductive glue to the grounded specimen mount. The tape is dead soft copper with a conductive acrylic adhesive. It is supplied on a removable liner for easy handling and cutting. The
